Publications

Journal Articles  (#: student authors) 

  1. Q. Huang*, “Mass Transport in Confined Micro Geometry in Reciprocating Paddle Plating Cell by Numerical Simulation and Neural Network Analysis”, Journal of the Electrochemical Society, 171, 092507, (2024). [link]
  2. Q. Liu#, and Q. Huang*, “Electrodeposition of ReMo Alloys”, Electrochimica Acata, 500, 144761, (2024). [link]
  3. Q. Liu#, and Q. Huang*, “Electrodeposition of Molybdenum from Water-in-Acetate Electrolytes”, Journal of the Electrochemical Society, 171, 062510, (2024). [link] 
  4. K. Ahammed#, L.-K. Tsui, S. Carroll, J. Lavin, and Q. Huang*, “Electrodeposited Superconducting Re on Flexible Substrates using Aerosol Jet Printed Metal Seed Layers”, IEEE Transaction on Applied Superconductivity, 33, 1102107 (2023). [link]
  5. K. Ahammed#, S. M. Taghavi Kouzehkanan, T.-S. Oh, and Q. Huang*, “Electrodeposited Rhenium Sandwich Structures with Thermal Expansion Mismatch and the Superconducting Transition Behaviors”, Journal of Alloys and Compounds, 960, 170808 (2023). [link]
  6. Q. Huang*, “Superconductivity of Electrodeposited Sn Films”, Journal of the Electrochemical Society, 170, 032506 (2023). [link]
  7. B. Malekpouri#, K. Ahammed#, and Q. Huang*, “Electrodeposition and superconductivity of rhenium-iron alloy films from water-in-salt electrolytes”, Journal of Alloys and Compounds, 912, 165077 (2022). [link]
  8. Y. Hu#, K. Ahammed#, Q. Liu#, R. Williams#, and Q. Huang*, “Effects of Ethylenediamine Tetrakis(ethoxylate-block-propoxylate) Tetrol on Tin Electrodeposition”, Electrochimica Acta, 421, 140476 (2022). [link]
  9. Q. Huang*, “Water in Sugar Electrolytes and Application to Electrodeposition of Superconducting Rhenium”, Journal of the Electrochemical Society, 169, 032501 (2022). [open access]
  10. J.  Wang, M. Liang, Y. Pan, S. Sun, T. Shen, X. Wei, Y. Zhu*, J. Liu*, and Q. Huang, “Control of surface composition and microstructure of nano super-hydrophilic TiO2-CuOy coatings through reactive sputtering to improve antibacterial ability, corrosion resistance, and biocompatibility”, Applied Surface Science, 578, 151893 (2022). [link]
  11. Y. Hu#, S. Deb, D. Li, and Q. Huang*, “Effects of Organic Additives on the Impurity and Grain Structure of Electrodeposited Cobalt”, Electrochimica Acta, 368, 137594 (2021). [link]
  12. Y. Hu#, and Q. Huang*, “Oscillatory Behavior in Cobalt Electrodeposition with 3-Mercapto-1-Propanesulfonate”, Journal of Physical Chemistry C, 124, 21608 (2020). [link]
  13. W. Sides#, and Q. Huang*, “Ruthenium Electrodeposition from Water-in-Salt Electrolytes and the Influence of Tetrabutylammonium”, Journal of the Electrochemical Society, 167, 100693 (2020). [open access]
  14. W. Sides#, E. Hassani#, D. P. Pappas, Y. Hu#, T.-S. Oh, and Q. Huang*, “Grain Growth and Superconductivity of Rhenium Electrodeposited from Water-in-salt Electrolytes”, Journal of Applied Physics, 127, 085301 (2020). [link]
  15. S. De#, J. White#, T. Brusuelas#, C. Patton#, A. Koh, and Q. Huang*, “Electrochemical Behavior of Protons and Cupric Ions in Water-in-salt Electrolytes with Alkaline Metal Chloride”, Electrochimica Acta, 338, 135852 (2020).​ [link]
  16. Y. Hu#, T. Lyons#, and Q. Huang*, “Influence of Furil Dioxime on Cobalt Electrochemical Nucleation and Growth”, Journal of the Electrochemical Society, 167, 022509 (2020). [open access]
  17. S. De#, W. D. Sides#, T. Brusuelas#, and Q. Huang*, “Electrodeposition of superconducting rhenium-cobalt alloys from water-in-salt electrolytes”, Journal of the Electroanalytical Chemistry, 860, 113889 (2020). [link]
  18. W. D. Sides#, N. Kassouf#, and Q. Huang*, “Electrodeposition of Ferromagnetic FeCo and FeCoMn Alloy from Choline Chloride Based Deep Eutectic Solvent”, Journal of the Electrochemical Society, 166, D77 (2019). [open access]
  19. Y. Hu#, and Q. Huang*, “Effects of Dimethylglyoxime and Cyclohexane Dioxime on the Electrochemical Nucleation and Growth of Cobalt”, Journal of the Electrochemical Society, 166, D3175 (2019). [open access]
  20. Q. Huang*, and Y. Hu#, “Electrodeposition of Superconducting Rhenium with Water-in-Salt Electrolyte”, Journal of the Electrochemical Society, 165, D796 (2018). [open access]
  21. W. D. Sides#, and Q. Huang*, “Electrochemical Nucleation and Growth of Antimony Telluride Binary Compound on Gold Substrate”, Journal of the Electrochemical Society, 165, D568 (2018). [open access]
  22. Q. Huang*, and T. W. Lyons#, “Electrodeposition of Rhenium with Suppressed Hydrogen Evolution from Water-in-salt Electrolyte”, Electrochemistry Communication, 93, 53 (2018).[link]
  23. Q. Huang*, “Effects of Impurity Elements on Isothermal Grain Growth of Electroplated Copper”, Journal of the Electrochemical Society, 165, D251 (2018). [open access]
  24. R.J. Morelock#, W. D. Sides#, Y. Hu#, and Q. Huang*, “Electrochemical deposition and anodic stripping of PdZn bimetallic compound”, Journal of Electroanalytical Chemistry, 815, 8 (2018).[link]
  25. W. D. Sides#, and Q. Huang*, “Electrodeposition of Manganese Thin Films on a Rotating Disc Electrode from Choline Chloride / Urea Based Ionic Liquids”, Electrochimica Acta, 266, 185 (2018).[link]
  26. Y. Zhu, Y.Q. Chen#, T. Shen*, J.H. Yi, G.Y. Gan, and Q. Huang*, “Direct Current Magnetron Sputtered Cu2ZnSnS4 Thin Films Using a Ceramic Quaternary Target”, Journal of Alloys and Compounds, 727, 1115 (2017).[link]
  27. Q. Huang*, R. Gyorgak#, and R. Pak#, “Electrochemical Formation of Freestanding 3D Structures using Injection of Additives”, Journal of the Electrochemical Society, 164(12), D737 (2017). [open access]
  28. T. Lyons#, and Q. Huang*, “Effects of Cyclohexane- Monoxime and Dioxime on the Electrodeposition of Cobalt”, Electrochimica Acta, 245, 309 (2017).[link]
  29. Q. Huang*, T. Lyons#, and W. Sides#, “Electrodeposition of Cobalt for Interconnect Application: Effect of Dimethylglyoxime”, Journal of the Electrochemical Society, 163(13) D715 (2016). [open access]
  30. Q. Huang*, K. Reuter, Y. Zhu, and V. Deline, “A Study on the Long-Term Degradation of Silicon Photovoltaic Cells Metallized with Electroplated Cu and Silicide”, ECS Journal of Solid State Science and Technology, 5(2), Q24 (2016). [open access]
  31. Q. Huang*, “A Study on the Electrodeposition and Silicidation of NiCo Alloys for Silicon Photovoltaic Cell Metalization”, ECS Journal of Solid State Science and Technology, 5(2), P51, (2016). [open access]
  32. Q. Huang*, S. S. Papa Rao, and K. Fisher, “Light Assisted Electrodeposition and Salicidation of Ni for Crystalline Silicon Photovoltaic Cell Metallization”, ECS Journal of Solid State Science and Technology, 4(8), Q75 (2015). [open access]
  33. S. Kitayaporn*, Q. Huang, M. Hopstaken, and B. Baker-O’Neal, “Tin Incorporated in Copper Films during Damascene Copper Electrodeposition”, Journal of the Electrochemical Society, 162, D74 (2015). [link]
  34. A. Sahin*, Q. Huang, J. Cotte, and B. Baker-O’Neal, “Electrochemical Palladium Deposition for Reducing Critical Dimension in Nanostructures”, Journal of the Electrochemical Society, 161, D697 (2014). [link]
  35. Q. Huang*, A. Avekians, S. Ahmed, C. Parks, B. Baker-O’Neal, S. Kitayaporn, A. Sahin, Y. Sun, T. Cheng, “Impurity in the Electrodeposited Sub-50 nm Cu Lines: the Effect of Additives”, Journal of the Electrochemical Society, 161, D388 (2014). [open access]
  36. D. Liang#, J. Liu, K. Reuter, B. Baker-O’Neal, Q. Huang*, “Electroplating of NiFe Alloys in Sub-50 nm Lines”, Journal of the Electrochemical Society, 161, D301 (2014). [open access]
  37. Q. Huang*, J. Liu, and B. Baker-O’Neal, “An Electrochemical Method of Suppressor Screening for Cu Plating in sub-100 nm Lines”, Journal of the Electrochemical Society, 161, D207 (2014). [open access]
  38. Q. Huang*, B. Baker-O’Neal, C. Cabral, E. Simonyi, V.R. Deline, and M. Hopstaken, “Enhanced Grain Growth of Electroplated Copper on Cobalt-containing Substrates”, Journal of the Electrochemical Society, 160, D3045 (2013). [link]
  39. Q. Huang*, B. Baker-O’Neal, C. Parks, M. Hopstaken, A. Fluegel, C. Emnet, M. Arnold and D. Mayer, “Leveler Effect and Oscillatory Behavior during Copper Electroplating”, Journal of the Electrochemical Society, 159, D526 (2012). [link]
  40. S. Ahmed*, K.B. Reuter, Q. Huang, H. Deligianni, L.T. Romankiw, S. Jaime and P.P. Grand, “Electrodeposited Gallium Alloy Thin Films Synthesized by Solid State Reactions for CIGS Solar Cell”, Journal of the Electrochemical Society, 159, D129 (2012). [link]
  41. Q. Huang*, K. Reuter, S. Ahmed, L. Deligianni, L. T. Romankiw, S. Jaimes, P.-P. Grand, and V. Charrier, “Electrodeposition of Indium on Copper for CIS and CIGS Solar Cell Applications”, Journal of the Electrochemical Society, 158, D57 (2011). [link]
  42. S. S. Papa Rao*, K. Fisher, D. Neumayer, Q. Huang, K. Kwietniak, J. Liu, J. Vichiconti, J. Nalskowski, J. Newbury, A. Pyzyna, S. Rossnagel, G. Totir, and N. Fuller, “Development and Characterization of Advanced Process Technologies for the Fabrication of Crystalline Si Solar Cells”, Proceeding of 35th IEEE PVSC (2010). [link]
  43. Q. Huang*, B. Baker-O’Neal, J. J. Kelly, P. Broekmann, A. Wirth, C. Emnet, M. Martin, M. Hahn, A. Wagner, and D. Mayer, “Suppressor Effects during Copper Superfilling of Sub-100 nm Features”, Electrochemical and Solid State Letters, 11(4), D27 (2009). [link]
  44. V. Venkatasamy*#, I. Shao, Q. Huang, and J. L. Stickney, “ALD Approach towards Electrodeposition of Sb2Te3 for Phase-Change Memory Applications”, Journal of the Electrochemical Society, 155(11), D693 (2008). [link]
  45. Q. Huang*, A. J. Kellock and S. Raoux, “Electrodeposition of SbTe Phase Change Alloys”, Journal of the Electrochemical Society, 155(2), D104 (2008). [link]
  46. J. J. Kelly*, T. Vo, O. Van de Straten, Q. Huang, B. Baker-O’Neal, I. Shao, S. Chiang, and J. Dukovic, “Morphology of Electrodeposited Cu on 300 mm PEALD Ruthenium”, ECS transaction, 16(4), 201 (2008). [link]​
  47. Q. Huang*, S. Bedell, K. Saenger, M. Copel, H. Deligianni, and L. T. Romankiw, “Single Crystal Germanium Thin Film from Electrodeposition of Solid Phase Epitaxy”, Electrochemical and Solid State Letters, 10(11), D124 (2007). [link]
  48. Q. Huang*, H. Deligianni, and L. T. Romankiw, “Anisotropic Growth of Nanostructures in Germanium Electroplating”, Electrochemical and Solid State Letters, 10(11), D 121 (2007). [link]
  49. Q. Huang*, C. Bonhŏte, J. Lam, L. T. Romankiw, “FeCo/Cu and FeCo/Ru Laminated Structures by Electroplating”, ECS Transactions, 3(25), 143 (2007). [link]
  50. Q. Huang*, C. Bonhŏte, J. Lam, and L. T. Romankiw, “The Electrodeposition of FeCoRu Alloy”, ECS Transactions, 3(25), 61 (2007). [link]
  51. Q. Huang#, D. Davis# and E. J. Podlaha*, “Electrodeposition of FeCoNiCu Nanowires”, Journal of Applied Electrochemistry, 36(8), 871 (2006). [link]
  52. Q. Huang, H. Deligianni*, and L. T. Romankiw, “Electrodeposition of Gold on Silicon, Nucleation and Growth Phenomena”, Journal of the Electrochemical Society, 153(5), C322 (2006). [link]
  53. Q. Huang*, H. Deligianni, and L. T. Romankiw, “Electrodeposition of Gold on Silicon”, ECS Transactions, 2(6), 299 (2006).
  54. Q. Huang#, and E. J. Podlaha*, “Selective Etching of FeCoNiCu/Cu Multilayers”, Journal of Applied Electrochemistry, 35(11), 1127 (2005). [link]
  55. Che-Yih Lim#, Q. Huang#, X. Xie, A. Safir#, S. A. Harfenist#, R. Cohn and E. J. Podlaha*, “Development of an Electrodeposited Nanomold from Compositionally Modulated Alloys”, Journal of Applied Electrochemistry, 34(8), 857 (2004). [link]
  56. Q. Huang# and E. J. Podlaha*, “Simulation of Pulsed Electrodeposition for GMR FeCoNiCu/Cu Multilayers”, Journal of the Electrochemical Society, 151(1), C119 (2004). [link]
  57. Q. Huang#, D. P. Young and E. J. Podlaha*, “Magnetoresistance in Electrodeposited Iron-Cobalt- Nickel-Copper Multilayers”, Journal of Applied Physics, 94(8), 1864 (2003). [link]
  58. Q. Huang# and E. J. Podlaha*, “A Model to Describe Pulsed Electrodeposition of GMR FeCoNiCu Alloys”, Proceedings of Seventh International Symposium on Magnetic Materials, Processes and Devices, The Electrochemical Society, Pennington, NJ, PV 2002-27, 414 (2003).
  59. Q. Huang#, D. P. Young, J. Y. Chan, J. Jiang and E. J. Podlaha*, “Electrodeposition of FeCoNiCu Compositionally Modulated Multilayer”, Journal of the Electrochemical Society, 149(6), C349 (2002). [link]

​Book and Book Chapter

  1. D. Million, Q. Huang, and Y. Zhu, “Novel Deposition Methods”, in Phase Change Materials: Science and Applications, Springer, 2009.
  2. E. J. Podlaha, Y. Li, J. Zhang, Q. Huang, A. Panda, A. Lozano-Morales, D. Davis, and Z. Guo, “Electrochemical Deposition of Nanostructured Metals”, in Handbook of Nanomaterials, CRC Press, New York, 2006.​​​ ​

Patents and Disclosures

Patents

  1. Q. Huang,  “Branched Nanochannel Devices for Detection and Sorting of Nucleic Acid”, US Patent 12,023,673 (2024).
  2. Q. Huang, “Methods and Systems for Electrochemical Additive Manufacturing”, US Patent 11,371,154 (2022).
  3. Q. Huang, “Methods for Electrodeposition”, US Patent 11,306,407 (2022).
  4. Q. Huang, “Methods and Systems for Electrochemical Additive Manufacturing”, US Patent 11,008,664 (2021).
  5. Q. Huang,  “Branched Nanochannel Devices for Detection and Sorting of Nucleic Acid”, US Patent 10,974,244 (2021).
  6. Q. Huang, K. P. Rodbell, and A. Sahin, “Chemically Strengthened Glass and Methods of Making Same”, US Patent 10,633,280 (2020).
  7. P. Andry, Q. Huang, Y. Luo and and A. Naganathan, “Micro Battery Design and Diagnosis”, US Patent 10,297,876 (2019).
  8. K. Fisher, Q. Huang, and S. S. Papa Rao, “Use of Phosphorus in Metallization of Photovoltaic Devices and Method of Fabricating Same”, US Patent 10,269,993 (2019)
  9. B. Baker-O’Neal, S. Chong, J. Cotte, R. Goldblatt, J. Hedrick, Q. Huang, S. Huang, L. Kosbar, R. Steeman, R. Utama, “Method for Fabricating a Photovoltaic Device by Uniform Plating on Dielectric Passivated Through-wafer Vias and Interconnects”, US Patent 10,199,516 (2019).
  10. K. Fisher, Q. Huang, and S. S. Papa Rao, “Processes for Uniform Metal Semiconductor Alloy Formation for Front Side Contact Metallization and Photovoltaic Device Formed Therefrom”, US Patent 10,170,644 (2019).
  11. P. Andry, Q. Huang, Y. Luo and and A. Naganathan, “Micro Battery Design and Diagnosis”, US Patent 10,162,013 (2018).
  12. Q. Huang, K. P. Rodbell, and A. Sahin, “Chemically Strengthened Glass and Methods of Making Same”, US Patent 10,112,867 (2018).
  13. Q. Huang, K. P. Rodbell, and A. Sahin, “Chemically Strengthened Glass and Methods of Making Same”, US Patent 9,890,075 (2018).
  14. C. Cabral, F. E. Doany, G. M. Fritz, M. S. Gordon, Q. Huang, E. P. Lewandowski, X. H. Liu, K. P. Rodbell, and T. M. Shaw, “Controlling Fragmentation of Chemically Strengthened Glass”, US Patent 9,738,560 (2017).
  15. Q. Huang, K. P. Rodbell, and A. Sahin, “Chemically Strengthened Glass and Methods of Making Same”, US Patent 9,718,728 (2017).
  16. B. Baker-O’Neal, S. Chong, J. M. Cotte, R. D. Goldblatt, J. Hedrick, Q. Huang, S. Huang, L. L. Kosbar, R. Steeman and R. Y. Utama, “Method for Fabricating a Photovoltaic Device by Uniform Plating on Emitter-lined Through-wafer Vias and Interconnects”, US Patent 9,716,192 (2017).
  17. S. Ahmed, P. De Gasquet, H. Deligianni, P.-P. Grand, Q. Huang, S. Jaime, L. T. Romankiw and R. Vaidyanathan, “Checking the Stoichiometry of I-III-VI Layers for Use in Photovoltaics Using Improved Electrolysis Conditions”, US Patent 9,647,151 (2017).
  18. P. Andry, Q. Huang, Y. Luo and and A. Naganathan, “Micro Battery Design and Diagnosis”, US Patent 9,620,824 (2017).
  19. K. Fisher, Q. Huang, and S. S. Papa Rao, “Processes for Uniform Metal Semiconductor Alloy Formation for Front Side Contact Metallization and Photovoltaic Device Formed Therefrom”, US Patent 9,608,134 (2017).
  20. C. Cabral, F. E. Doany, G. M. Fritz, M. S. Gordon, Q. Huang, E. P. Lewandowski, X. H. Liu, K. P. Rodbell, and T. M. Shaw, “Controlling Fragmentation of Chemically Strengthened Glass”, US Patent 9,586,857 (2017).
  21. S. Ahmed, H. Deligianni, Q. Huang, K. Reuter, L. T. Romankiw, and R. Vaidyanathan, “Electrodeposition Methods of Gallium and Gallium Alloy Films and Related Photovoltaic Structures”, US Patent 9,401,443 (2016).
  22. S. Ahmed, H. Deligianni, Q. Huang, L. T. Romankiw, and R. Vaidyanathan, “Pressure Transfer Process for Thin Film Solar Cell Fabrication”, US Patent 9,293,632 (2016).
  23. K. Fisher, Q. Huang, and S. S. Papa Rao, “Use of Phosphorus in Metallization of Photovoltaic Devices and Method of Fabricating Same”, US Patent 9,284,656 (2016).
  24. K. Fisher, Q. Huang, S. S. Papa Rao, and M. Yeh, “Photovoltaic Device with Aluminum Plated Back Surface Field and Method of Forming Same”, US Patent 9,246,024 (2016).
  25. K. Fisher, Q. Huang, and S. S. Papa Rao, “Processes for Uniform Metal Semiconductor Alloy Formation for Front Side Contact Metallization and Photovoltaic Device Formed Therefrom”, US Patent 8,969,122 (2015).
  26. K. C. Fisher, H. Hovel, Q. Huang, S. Huang, Y. Kim, and S. S. Papa Rao, “Integration of a Titania Layer in an Anti-reflective Coating for Si Photovoltaic Cell”, US Patent 8,962,374 (2015).
  27. K. C. Fisher, H. Hovel, Q. Huang, S. Huang, Y. Kim, and S. S. Papa Rao, “Integration of a Titania Layer in an Anti-reflective Coating for Si Photovoltaic Cell”, US Patent 8,946,844 (2015).
  28. B. Baker-O’Neal and Q. Huang, “Photovoltaic Cells with Copper Grid”, US Patent 8,901,414 (2014).
  29. Q. Huang, “Photovoltaic Devices with Metal Semiconductor Alloy Metallization”, US Patent 8,884,159 (2014).
  30. H. Hovel, Q. Huang, X. Shao, J. Vinchiconti, and G. Walker, “Super-lattice / Quantum Well Nanowires”, US patent 8,878,259 (2014).
  31. C. Cabral, J. Gambino, Q. Huang, T. Nogami, and K. Rodbell, “Microstructure Modification in Copper Interconnect Structures Using Manganese”, US patent 8,828,870 (2014).
  32. S. Bedell, H. Deligianni, Q. Huang, L. T. Romankiw, and K. Saenger, “Electrodeposition Method for Forming Germanium on Semiconductor Substrates”, US patent 8,823,143 (2014).
  33. Q. Huang, J. Liu, and Y. Kim, “Buried Selective Emitter Formation for Photovoltaic Devices Utilizing Metal Nanoparticle Catalyzed Etching”, US Patent 8,759,139 (2014).
  34. H. Deligianni, Q. Huang, and L. T. Romankiw, “Vertical Nanowire FET Devices”, US patent 8,637,849 (2014).
  35. C. Cabral, J. Gambino, Q. Huang, T. Nogami, and K. Rodbell, “Microstructure Modification in Copper Interconnect Structures Using Manganese”, US patent 8,492,897 (2013).
  36. B. Cedric, P. Grand, Q. Huang, S. Jaime, and K. Reuter, “Fabrication of a Multilayer Structure for Photovoltaic Applications from Improved Electrolysis Conditions”, FR patent 2955428 (2013).
  37. H. Hovel, Q. Huang, X. Shao, J. Vinchiconti, and G. Walker, “Super-lattice / Quantum Well Nanowires”, US patent 8,273,591 (2012).
  38. H. Deligianni, Q. Huang, J. Hummel, L. T. Romankiw, and M. Rothwell, “Formation of Vertical Devices by Electroplating”, US patent 8,247,905 (2012).
  39. G. Cohen, H. Deligianni, Q. Huang, and L. T. Romankiw, “Self-constrained Anisotropic Germanium Nanostructure from Electroplating”, US patent 8,115,191 (2012).
  40. S. Ahmed, H. Deligianni, P. Grand, Q. Huang, S. Jaime, M. Mason, K. Reuter, E. Roche, L. T. Romankiw, R. Vaidyanathan, and D. Zupanski-Nielsen, “Improved Interface between a I-III-VI2 Material Layer and a Molybdenum Substrate”, WO patent 2012089558 (2012).
  41. B. Baker-O’Neal, C. Cabral, Q. Huang, and K. Rodbell, “Microstructure Modification in Copper Interconnect Structures Using Cobalt”, US patent 8,008,199 (2011).
  42. Q. Huang, A. J. Kellock, X. Shao and V. Venkatasamy, “Method of Electrodepositing Germanium Compound Materials on a Substrate”, US patent 7,918,984 (2011).
  43. H. Deligianni, Q. Huang, and L. T. Romankiw, “Methods of Manufacture of Vertical Nanowire FET Devices”, US patent 7,892,956 (2011).
  44. B. Baker-O’Neal, C. Cabral, Q. Huang, and K. Rodbell, “Microstructure Modification in Copper Interconnect Structures Using Cobalt”, US patent 7,843,063 (2010).
  45. S. Bedell, H. Deligianni, Q. Huang, L. T. Romankiw, and K. Saenger, “Structures Containing Electrodeposited Germanium and Methods for Their Fabrication”, US patent 7,785,982 (2010).
  46. H. Deliganni, Q. Huang, and L. T. Romankiw, “Formation of Nanostructures Comprising Compositionally Modulated Ferromagnetic Layers by Pulsed ECD”, US patent 7,736,753 (2010).
  47. G. Cohen, H. Deligianni, Q. Huang, and L. T. Romankiw, “Self-constrained Anisotropic Germanium Nanostructure from Electroplating”, US patent 7,659,200 (2010).
  48. H. Deligianni, Q. Huang, J. Hummel, L. T. Romankiw, and M. Rothwell, “Formation of Vertical Devices by Electroplating”, US patent 7,608,538 (2009).
  49. H. Deligianni, Q. Huang, and L. T. Romankiw, “Memory Storage Devices Comprising Different Ferromagnetic Material Layers and Methods of Making and Using the Same”, US patent 7,539,051 (2009).

Disclosures and Other Patent Applications

  1. B. Baker-O’Neal, J. M. Cotte, R. Goldblatt, J. Hedrick, Q. Huang, S. Huang, L. L. Kosbar, C. Lavoie, X. Shao, R. Steeman, “Manufacture and Structure for Photovoltaics including Metal-Rich Silicide”, US Patent Application 20150325716.
  2. J. Liu, Q. Huang, Y-H. Kim, “Inverted Pyramid Texture Formation on Single Crystalline Silicon”, US Patent Application 20130025663.
  3. S. Ahmed, H. Deligianni, P. Grand, Q. Huang, S. Jaime, M. Mason, K. Reuter, E. Roche, L. T. Romankiw, R. Vaidyanathan, and D. Zupanski-Nielsen, “Interface between a I-III-VI2 Material Layer and a Molybdenum Substrate”, US Patent Application 20130269780.
  4. S. Ahmed, S. Grunow, Q. Huang, and C. Tsung, “Method and System to Develop a Hybrid Contact Via (CA) Plug without Seams or Voids using Electroplating”, IP disclosure number IPCOM000239407D.
  5. Q. Huang, A. Kellock, X. Shao, “Bath for Electroplating a I-III-VI Compound, Use Thereof and Structures Containing Same”, US Patent Application 20100213073.
  6. Q. Huang, X. Shao, J. L. Stickney, and V. Venkatasamy, “Method of Making Phase Change Materials by Electrochemical Atomic Layer Deposition”, US patent application 20090011577.
  7. G. Cohen, H. Deligianni, Q. Huang, and L. T. Romankiw, “Self-Aligned Epitaxial Growth of Semiconductor Nanowires”, US Patent Application 20080191317.

Commercialized Products

Commercial Chemistry Products

  1. CUPUR(TM) Alpha 3000, 3010, and 3060 Cu damascene chemistries for advanced Cu BEOL interconnects manufacturing (three chemistries commercialized by BASF).
  2. CUPUR(TM) Alpha 4000, 4030, and 4050 levelers for advanced Cu BEOL interconnects manufacturing (three additional levelers commercialized by BASF).

Scaled-up Manufacturing Processes

  1. Manufacturing process for Cu BEOL interconnects for 22 nm and 14 nm technologies, implemented at IBM Microelectronics (now GlobalFoundries), NY.
  2. Pilot manufacturing process for Cu(InGa)Se2 thin film solar cells, implemented at NEXCIS (subsidy of EDF), France.
  3. ​Pilot development process and tool design for Cu front grid manufacturing for crystalline Si solar cells implemented at REC Solar, Singapore.